The machining characteristics of glass substrates containing chemical components were investigated for the purpose of femtosecond laser helical drilling. A femtosecond laser of wavelength 1552 nm and pulse duration 800 fs was adopted in the laser machining system. The substrates investigated were aluminosilicate, soda-lime, and borosilicate glass. The chemical components contained in each glass substrate were quantitatively analyzed by laser ablation-induced chemical plasma mass spectrometry. The characteristics of the drilling conditions for each glass substrate were affected by its chemical components. As the wt% of Al(2)O(3)and MgO components in the glass substrates increased, the ablation threshold energy of each substrate decreased, resulting in greater vertical speed of the laser head.