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Secure Integrated Circuit with Physical Attack Detection based on Reconfigurable Top Metal Shield
- Title
- Secure Integrated Circuit with Physical Attack Detection based on Reconfigurable Top Metal Shield
- Authors
- Mun, Yeongjin; Kim, Hyungseup; Lee, Byeoncheol; Han, Kwonsang; Kim, Jaesung; Kim, Ji-Hoon; Choi, Byong-Deok; Kim, Dong Kyue; Ko, Hyoungho
- Ewha Authors
- 김지훈
- SCOPUS Author ID
- 김지훈
- Issue Date
- 2019
- Journal Title
- JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE
- ISSN
- 1598-1657
2233-4866
- Citation
- JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE vol. 19, no. 3, pp. 260 - 269
- Keywords
- Terms-Active shield; hardware security; invasive attack; micro-probing attempt; top metal shield
- Publisher
- IEEK PUBLICATION CENTER
- Indexed
- SCIE; SCOPUS; KCI
- Document Type
- Article
- Abstract
- Invasive physical attacks on integrated circuits (ICs), such as de-packaging, focused ion beam (FIB) chip editing, and micro-probing attempts, constitute security threats for chips with potentially valuable information, such as smart cards. Using a state-of-the-art circuit-editing technique, an attacker can remove an IC's top metal layer, leaving its secure information exposed to micro-probing attacks. Security ICs can be seriously threatened by such attacks and thus require on-chip countermeasures. Conventional active shields, however, have difficulty coping with physical attacks based on FIB chip editing (i.e., bypassing the top metal shield). This study presents a novel countermeasure against physical attacks based on the use of a reconfigurable metal shield for both top metal removal and micro-probing attack detection. This shield consists of two circuits: an FIB chip editing detection circuit consisting of a random number generator and a micro-probing attempt detection circuit consisting of two conditionally synchronized ring oscillators. Both circuits share a randomly reconfigured top metal shield, which represents a promising solution for security against state-of-the-art invasive attacks.
- DOI
- 10.5573/JSTS.2019.19.3.260
- Appears in Collections:
- 공과대학 > 전자전기공학전공 > Journal papers
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