Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 지창현 | * |
dc.date.accessioned | 2016-08-28T10:08:03Z | - |
dc.date.available | 2016-08-28T10:08:03Z | - |
dc.date.issued | 2013 | * |
dc.identifier.issn | 0960-1317 | * |
dc.identifier.other | OAK-10131 | * |
dc.identifier.uri | https://dspace.ewha.ac.kr/handle/2015.oak/223767 | - |
dc.description.abstract | A monolithically integrated glass microlens optical scanner is presented. A new wafer-level fabrication approach addresses the issue of microlens integration and alignment in conventional microlens integrated devices. A through-silicon plano-convex glass microlens has been fabricated on a silicon substrate prior to the formation of an integrated microlens actuator, realized through two thermal reflow processes at 850 °C. A lateral comb drive is adapted to demonstrate the glass microlens scanner. The 800 m diameter microlens was laterally shifted up to ±51.6 m when an ac voltage of 28.5 V in amplitude was applied at a resonant frequency of 1.749 kHz at atmospheric pressure. The optical scanning angle of ±2.0° has been obtained with the fabricated device. © 2013 IOP Publishing Ltd. | * |
dc.language | English | * |
dc.title | Monolithically integrated glass microlens scanner using a thermal reflow process | * |
dc.type | Article | * |
dc.relation.issue | 6 | * |
dc.relation.volume | 23 | * |
dc.relation.index | SCI | * |
dc.relation.index | SCIE | * |
dc.relation.index | SCOPUS | * |
dc.relation.journaltitle | Journal of Micromechanics and Microengineering | * |
dc.identifier.doi | 10.1088/0960-1317/23/6/065012 | * |
dc.identifier.wosid | WOS:000319451300012 | * |
dc.identifier.scopusid | 2-s2.0-84878143837 | * |
dc.author.google | Yoo S. | * |
dc.author.google | Ha J.-G. | * |
dc.author.google | Jin J.-Y. | * |
dc.author.google | Ji C.-H. | * |
dc.author.google | Kim Y.-K. | * |
dc.contributor.scopusid | 지창현(7202015390) | * |
dc.date.modifydate | 20240322125611 | * |