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dc.contributor.author김성호*
dc.date.accessioned2024-05-17T16:31:18Z-
dc.date.available2024-05-17T16:31:18Z-
dc.date.issued2024*
dc.identifier.issn2045-2322*
dc.identifier.otherOAK-35037*
dc.identifier.urihttps://dspace.ewha.ac.kr/handle/2015.oak/268314-
dc.description.abstractNanosheet field-effect transistors (NSFETs) have attracted considerable attention for their potential to achieve improved performance and energy efficiency compared to traditional FinFETs. Here, we present a comprehensive investigation of core-insulator-embedded nanosheet field-effect transistors (C-NSFETs), focusing on their improved performance and device-to-device (D2D) variability compared to conventional NSFETs through three-dimensional device simulations. The C-NSFETs exhibit enhanced direct-current (DC) performance, characterized by a steeper subthreshold slope and reduced off-current, indicating better gate electrostatic controllability. Furthermore, the structural design of C-NSFETs enables to demonstrate a notable resilience against D2D variations in nanosheet thickness and doping concentration. In addition, we investigate the effects of interface traps in C-NSFETs, emphasizing the importance of thermal oxidation processes in the formation of core-insulating layers to maintain optimal device performance. © The Author(s) 2024.*
dc.languageEnglish*
dc.publisherNature Research*
dc.titleCore-insulator embedded nanosheet field-effect transistor for suppressing device-to-device variations*
dc.typeArticle*
dc.relation.issue1*
dc.relation.volume14*
dc.relation.indexSCIE*
dc.relation.indexSCOPUS*
dc.relation.journaltitleScientific Reports*
dc.identifier.doi10.1038/s41598-024-58081-z*
dc.identifier.wosidWOS:001195862400062*
dc.identifier.scopusid2-s2.0-85188803205*
dc.author.googleSon*
dc.author.googleDonghwi*
dc.author.googleLee*
dc.author.googleHyunwoo*
dc.author.googleKim*
dc.author.googleHyunsoo*
dc.author.googleAhn*
dc.author.googleJae-Hyuk*
dc.author.googleSungho*
dc.date.modifydate20240607120022*
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