DSpace at EWHA: Heel pad becomes rapidly stiffer to dissipate the energy: finite element analysis

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DC Field	Value	Language
dc.contributor.author	이태용	*
dc.date.accessioned	2019-08-27T16:30:08Z	-
dc.date.available	2019-08-27T16:30:08Z	-
dc.date.issued	2019	*
dc.identifier.issn	1942-4280	*
dc.identifier.other	OAK-25279	*
dc.identifier.uri	https://dspace.ewha.ac.kr/handle/2015.oak/251309	-
dc.description.abstract	[No abstract available]	*
dc.language	English	*
dc.publisher	Taylor and Francis Ltd.	*
dc.subject	compression	*
dc.subject	energy dissipation	*
dc.subject	finite element models (FEM)	*
dc.subject	heel pad	*
dc.subject	stiffness (bending or compressive)	*
dc.title	Heel pad becomes rapidly stiffer to dissipate the energy: finite element analysis	*
dc.type	Article	*
dc.relation.issue	sup1	*
dc.relation.volume	11	*
dc.relation.index	SCOPUS	*
dc.relation.startpage	S79	*
dc.relation.lastpage	S80	*
dc.relation.journaltitle	Footwear Science	*
dc.identifier.doi	10.1080/19424280.2019.1606088	*
dc.identifier.scopusid	2-s2.0-85069640830	*
dc.author.google	Wee J.	*
dc.author.google	Lee T.	*
dc.contributor.scopusid	이태용(55799205800)	*
dc.date.modifydate	20240429142129	*