DSpace at EWHA: Vacuum packaged electromagnetic 2D scanning micromirror

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DC Field	Value	Language
dc.contributor.author	지창현	*
dc.date.accessioned	2019-05-03T16:30:09Z	-
dc.date.available	2019-05-03T16:30:09Z	-
dc.date.issued	2019	*
dc.identifier.issn	0924-4247	*
dc.identifier.other	OAK-24682	*
dc.identifier.uri	https://dspace.ewha.ac.kr/handle/2015.oak/249733	-
dc.description.abstract	We herein present the design, fabrication, and wafer-level packaging of an electromagnetic biaxial scanning micromirror. The vacuum packaging of the micromirror was implemented by anodically bonding the glass cap wafer to both sides of the silicon substrate with the micromirror. The measured quality factor of the vacuum packaged micromirror is 1923.2 for the horizontal scan, whereas that of the device in the air is 649.6. The maximum optical scan angle of the vacuum packaged micromirror is 24.19 degrees at 155 mApp and 11.9 kHz for the horizontal scan, and 7.1 degrees at 204.7 mApp and 60 Hz for the vertical scan. The estimated vacuum level of the package is 1.65 +/- 0.85 Torr. (C) 2019 Elsevier B.V. All rights reserved.	*
dc.language	English	*
dc.publisher	ELSEVIER SCIENCE SA	*
dc.subject	Electromagnetic biaxial scanning micromirror	*
dc.subject	Vacuum packaging	*
dc.subject	Wafer-level packaging	*
dc.title	Vacuum packaged electromagnetic 2D scanning micromirror	*
dc.type	Article	*
dc.relation.volume	290	*
dc.relation.index	SCIE	*
dc.relation.index	SCOPUS	*
dc.relation.startpage	147	*
dc.relation.lastpage	155	*
dc.relation.journaltitle	SENSORS AND ACTUATORS A-PHYSICAL	*
dc.identifier.doi	10.1016/j.sna.2019.03.021	*
dc.identifier.wosid	WOS:000466256000019	*
dc.identifier.scopusid	2-s2.0-85063319668	*
dc.author.google	Chung, Seung-Han	*
dc.author.google	Lee, Seung-Ki	*
dc.author.google	Ji, Chang-Hyeon	*
dc.author.google	Park, Jae-Hyoung	*
dc.contributor.scopusid	지창현(7202015390)	*
dc.date.modifydate	20240322125611	*