Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김동욱 | * |
dc.date.accessioned | 2018-12-07T16:30:22Z | - |
dc.date.available | 2018-12-07T16:30:22Z | - |
dc.date.issued | 2017 | * |
dc.identifier.issn | 2046-2069 | * |
dc.identifier.other | OAK-21355 | * |
dc.identifier.uri | https://dspace.ewha.ac.kr/handle/2015.oak/247289 | - |
dc.description.abstract | We investigated the properties of thermally evaporated Ag-Cu films for application as flexible and semi-transparent electrodes for semi-transparent flexible thin film heaters (TFHs) and heat shielding films (HSFs). The effects of Ag-Cu thickness on the electrical, optical, morphological, and mechanical properties of the Ag-Cu films were investigated in detail. Based on figure of merit values calculated from the sheet resistance and optical transmittance, we optimized the thickness of the Ag-Cu alloy film. Optimized film showed no resistance changes and no cracks, even with inner and outer bending radii smaller than 5 mm, indicating sufficiently high flexibility for application in TFHs and HSFs. In addition, we measured the work function of the Ag-Cu films using Kelvin probe force microscopy to correlate the work function and surface morphology. The effect of the thickness of the Ag-Cu alloy electrodes on the saturation voltage and temperature of flexible TFHs was also investigated. In addition, we investigated the feasibility of using semi-transparent Ag-Cu alloy film in HSFs. Effective heat generation and heat shield performance of Ag-Cu alloy films suggest that the multi-functional Ag-Cu films described here can potentially be applied to create energy-efficient automobile windows and smart windows for building energy management systems. © 2017 The Royal Society of Chemistry. | * |
dc.description.sponsorship | Ministry of Trade, Industry and Energy | * |
dc.language | English | * |
dc.publisher | Royal Society of Chemistry | * |
dc.title | Highly flexible and semi-transparent Ag-Cu alloy electrodes for high performance flexible thin film heaters | * |
dc.type | Article | * |
dc.relation.issue | 72 | * |
dc.relation.volume | 7 | * |
dc.relation.index | SCIE | * |
dc.relation.index | SCOPUS | * |
dc.relation.startpage | 45484 | * |
dc.relation.lastpage | 45494 | * |
dc.relation.journaltitle | RSC Advances | * |
dc.identifier.doi | 10.1039/c7ra08480c | * |
dc.identifier.wosid | WOS:000412147000031 | * |
dc.identifier.scopusid | 2-s2.0-85030260619 | * |
dc.author.google | Cho K.-S. | * |
dc.author.google | Kim E. | * |
dc.author.google | Kim D.-W. | * |
dc.author.google | Kim H.-K. | * |
dc.contributor.scopusid | 김동욱(57203350633) | * |
dc.date.modifydate | 20240123114549 | * |