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dc.contributor.author김동욱*
dc.date.accessioned2018-12-07T16:30:22Z-
dc.date.available2018-12-07T16:30:22Z-
dc.date.issued2017*
dc.identifier.issn2046-2069*
dc.identifier.otherOAK-21355*
dc.identifier.urihttps://dspace.ewha.ac.kr/handle/2015.oak/247289-
dc.description.abstractWe investigated the properties of thermally evaporated Ag-Cu films for application as flexible and semi-transparent electrodes for semi-transparent flexible thin film heaters (TFHs) and heat shielding films (HSFs). The effects of Ag-Cu thickness on the electrical, optical, morphological, and mechanical properties of the Ag-Cu films were investigated in detail. Based on figure of merit values calculated from the sheet resistance and optical transmittance, we optimized the thickness of the Ag-Cu alloy film. Optimized film showed no resistance changes and no cracks, even with inner and outer bending radii smaller than 5 mm, indicating sufficiently high flexibility for application in TFHs and HSFs. In addition, we measured the work function of the Ag-Cu films using Kelvin probe force microscopy to correlate the work function and surface morphology. The effect of the thickness of the Ag-Cu alloy electrodes on the saturation voltage and temperature of flexible TFHs was also investigated. In addition, we investigated the feasibility of using semi-transparent Ag-Cu alloy film in HSFs. Effective heat generation and heat shield performance of Ag-Cu alloy films suggest that the multi-functional Ag-Cu films described here can potentially be applied to create energy-efficient automobile windows and smart windows for building energy management systems. © 2017 The Royal Society of Chemistry.*
dc.description.sponsorshipMinistry of Trade, Industry and Energy*
dc.languageEnglish*
dc.publisherRoyal Society of Chemistry*
dc.titleHighly flexible and semi-transparent Ag-Cu alloy electrodes for high performance flexible thin film heaters*
dc.typeArticle*
dc.relation.issue72*
dc.relation.volume7*
dc.relation.indexSCIE*
dc.relation.indexSCOPUS*
dc.relation.startpage45484*
dc.relation.lastpage45494*
dc.relation.journaltitleRSC Advances*
dc.identifier.doi10.1039/c7ra08480c*
dc.identifier.wosidWOS:000412147000031*
dc.identifier.scopusid2-s2.0-85030260619*
dc.author.googleCho K.-S.*
dc.author.googleKim E.*
dc.author.googleKim D.-W.*
dc.author.googleKim H.-K.*
dc.contributor.scopusid김동욱(57203350633)*
dc.date.modifydate20240123114549*
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자연과학대학 > 물리학전공 > Journal papers
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