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Reverse thermal organogels

Title
Reverse thermal organogels
Authors
Jeong Y.Joo M.K.Sohn Y.S.Jeong B.
Ewha Authors
손연수정병문
SCOPUS Author ID
손연수scopus; 정병문scopus
Issue Date
2007
Journal Title
Advanced Materials
ISSN
0935-9648JCR Link
Citation
Advanced Materials vol. 19, no. 22, pp. 3947 - 3950
Indexed
SCI; SCIE; SCOPUS WOS scopus
Document Type
Article
Abstract
The poly(ethylene glycol), poly(L-alanine-co-L-phenyl alanine) diblock copolymer (PEG-PAF), forming a free-flowing solution in chloroform at low temperature forms a gel as the temperature increases above 20°C. The transmission electron microscopy (TEM) image of the PEG-PAF developed in chloroform showed that spherical micelles with a size of 20-50 nm is packed together. The delicate balance between solvency and nonsolvency of a block copolymer might drive reverse thermal gelation in the solvent. This system expands the applications of organogels to sensors, media for electrochemistry carriers, and rheological modifiers, where the characteristics of low viscosity at low temperature and gel at high temperature are required.
DOI
10.1002/adma.200700149
Appears in Collections:
자연과학대학 > 화학·나노과학전공 > Journal papers
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