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Determining the machining parameters for femtosecond laser helical drilling of aluminosilicate glass substrate

Title
Determining the machining parameters for femtosecond laser helical drilling of aluminosilicate glass substrate
Authors
Lee H.-M.Choi J.H.Moon S.-J.
Ewha Authors
최정현
SCOPUS Author ID
최정현scopus
Issue Date
2017
Journal Title
International Journal of Precision Engineering and Manufacturing
ISSN
2234-7593JCR Link
Citation
vol. 18, no. 7, pp. 923 - 930
Keywords
DrillingFemotosecond laserGlass
Publisher
SpringerOpen
Indexed
SCIE; SCOPUS; KCI WOS scopus
Abstract
In this work, a new laser helical drilling method with high geometrical accuracy is proposed for aluminosilicate glass (ASG) substrates. Laser drilling was performed from the bottom of the substrate to reduce the taper angle. The 400 μm-thick ASG substrates were drilled via a femtosecond laser beam with a wavelength of 1552 nm and a pulse duration of 800 fs. By applying this newly suggested method, thru-holes can be produced with a high roundness accuracy that is less than 20 μm, a small taper angle, low surface roughness of the sidewall, and high quality laser-drilled edges without cracks or chippings for hole diameters of 0.5, 1, 2, and 3 mm. Correlations are proposed between laser drilling parameters, such as ablation depth, scanning speed, vertical motion speed, and helical layer pitch, each of which are critical variables in drilling thru-holes in ASG substrates. Good surface quality of thru-holes can be experimentally obtained using the machining parameter values estimated by the proposed theory. © 2017, Korean Society for Precision Engineering and Springer-Verlag GmbH Germany.
DOI
10.1007/s12541-017-0109-1
Appears in Collections:
엘텍공과대학 > 환경공학전공 > Journal papers
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