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Effects of carbon residue in atomic layer deposited Hf O2 films on their time-dependent dielectric breakdown reliability

Title
Effects of carbon residue in atomic layer deposited Hf O2 films on their time-dependent dielectric breakdown reliability
Authors
Cho M.Kim J.H.Hwang C.S.Ahn H.-S.Han S.Won J.Y.
Ewha Authors
한승우
Issue Date
2007
Journal Title
Applied Physics Letters
ISSN
0003-6951JCR Link
Citation
vol. 90, no. 18
Indexed
SCI; SCIE; SCOPUS WOS scopus
Abstract
The effect of the carbon residue on the reliability of Hf O2 thin films was investigated. Hf O2 films were deposited on Si wafers by atomic layer deposition at a wafer temperature of 250 °C using Hf [N (C H3) 2] 4 and O3 oxidant with two different densities (160 and 390 g m3). The films deposited at the higher O3 density contained a lower concentration of carbon impurities. The leakage current density was lower and the time-dependent dielectric breakdown was improved in the higher O3 density films. First principles calculations confirmed that trap sites were generated in the band gap of Hf O2 when carbon was interstitially or substitutionally present. © 2007 American Institute of Physics.
DOI
10.1063/1.2735945
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자연과학대학 > 물리학전공 > Journal papers
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