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Fabrication and validation of flexible neural electrodes based on polyimide tape and gold sheet

Title
Fabrication and validation of flexible neural electrodes based on polyimide tape and gold sheet
Authors
JeongHyunbeenLeeTaekyungKimJisungHee SooJunSang BeomSeoJong-Mo
Ewha Authors
전상범
SCOPUS Author ID
전상범scopus
Issue Date
2024
Journal Title
Biomedical Engineering Letters
ISSN
2093-9868JCR Link
Citation
Biomedical Engineering Letters vol. 14, no. 2, pp. 267 - 278
Keywords
Gold sheetNeural electrodesPolyimide tapeUV laser
Publisher
Springer Verlag
Indexed
SCIE; SCOPUS; KCI WOS scopus
Document Type
Article
Abstract
This research was conducted to apply polyimide tape, which has the advantages of low price ans strong adhesive strength, to the neural electrode process. In addition, to maximize the low-cost characteristics, a fabrication process based on UV laser patterning rather than a photolithography process was introduced. The fabrication process started by attaching the gold sheet on the conductive double-sided tape without being torn or crushed. Then, the gold sheet and the double-sided tape were patterned together using UV laser. The patterned layer was transferred to the single-side polyimide tape. For insulation layer, electrode site opened single-sided polyimide tape was prepared. Polydimethylsiloxane was used as an adhesion layer, and alignment between electrode sites and opening sites was processed manually. The minimum line width achieved through the proposed fabrication process was approximately 100 μm, and the sheet resistance of the conductive layer was 0.635 Ω/sq. Measured cathodal charge storage capacity was 0.72 mC/cm2 and impedance at 1 kHz was 4.07 kΩ/cm2. Validation of fabricated electrode was confirmed by conducting 30 days accelerated soak test, flexibility test, adhesion test and ex vivo stimulation test. The novel flexible neural electrodes based on single-sided polyimide tape and UV laser patterned gold sheet was fabricated successfully. Conventional neural electrode fabrication processes based on polyimide substrate has a disadvantages such as long fabrication time, expensive costs, and probability of delamination between layers. However, the novel fabrication process which we introduced can overcome many shortcomings of existing processes, and offers great advantages such as simplicity of fabrication, inexpensiveness, flexibility and long-term reliability. © The Author(s) 2024.
DOI
10.1007/s13534-023-00345-0
Appears in Collections:
공과대학 > 전자전기공학전공 > Journal papers
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