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Interconnection parameter extraction of printed circuit board by hybrid measurements of TDR and S-parameter
- Title
- Interconnection parameter extraction of printed circuit board by hybrid measurements of TDR and S-parameter
- Authors
- Kim, YJ; Wee, JK; Kim, YH; Lee, S
- Ewha Authors
- 이성수
- Issue Date
- 2002
- Journal Title
- ELECTRONICS LETTERS
- ISSN
- 0013-5194
- Citation
- ELECTRONICS LETTERS vol. 38, no. 17, pp. 969 - 970
- Publisher
- IEE-INST ELEC ENG
- Indexed
- SCI; SCIE; SCOPUS
- Document Type
- Article
- Abstract
- A modified technique for extracting the electrical parameters of transmission line on PCBs is proposed. It exploits hybrid measurements of the time domain and frequency domain response and does not require complicated and erroneous procedures such as DC capacitance measurement and parameter de-embedding. Experimental results show that the proposed method is more accurate than conventional methods.
- DOI
- 10.1049/el:20020683
- Appears in Collections:
- 인공지능대학 > 컴퓨터공학과 > Journal papers
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