View : 1126 Download: 0

Full metadata record

DC Field Value Language
dc.contributor.author김정태*
dc.date.accessioned2020-01-21T16:30:11Z-
dc.date.available2020-01-21T16:30:11Z-
dc.date.issued2020*
dc.identifier.issn2234-7593*
dc.identifier.issn2005-4602*
dc.identifier.otherOAK-26355*
dc.identifier.urihttps://dspace.ewha.ac.kr/handle/2015.oak/252472-
dc.description.abstractWe present a deep learning based defect inspection system that detects bounding boxes for any identified defect regions. In contrast to existing deep learning based object detection methods, the proposed method detects defects based on the intersection over minimum between a proposal region and defect regions rather than the well-known intersection over union, since intersection over minimum is more effective to detect variously sized defects. The proposed method also provides significant improvements over existing methods such as efficient training by minimizing cross entropy loss function, and efficient defect detection using multiple proposal boxes for the defect and entire image. We verified that the proposed method provides improved performance compared with existing methods using simulation and experimental studies.*
dc.languageEnglish*
dc.publisherKOREAN SOC PRECISION ENG*
dc.subjectDefect inspection*
dc.subjectMachine vision*
dc.subjectDeep learning*
dc.subjectObject detection*
dc.titleDeep Learning Based Defect Inspection Using the Intersection Over Minimum Between Search and Abnormal Regions*
dc.typeArticle*
dc.relation.issue4*
dc.relation.volume21*
dc.relation.indexSCIE*
dc.relation.indexSCOPUS*
dc.relation.indexKCI*
dc.relation.startpage747*
dc.relation.lastpage758*
dc.relation.journaltitleINTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING*
dc.identifier.doi10.1007/s12541-019-00269-9*
dc.identifier.wosidWOS:000505368000002*
dc.identifier.scopusid2-s2.0-85077570526*
dc.author.googleChoi, Eunjeong*
dc.author.googleKim, Jeongtae*
dc.contributor.scopusid김정태(55720002700;35484385500)*
dc.date.modifydate20240322125435*
Appears in Collections:
공과대학 > 전자전기공학전공 > Journal papers
Files in This Item:
There are no files associated with this item.
Export
RIS (EndNote)
XLS (Excel)
XML


qrcode

BROWSE