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Vacuum packaged electromagnetic 2D scanning micromirror

Title
Vacuum packaged electromagnetic 2D scanning micromirror
Authors
Chung, Seung-HanLee, Seung-KiJi, Chang-HyeonPark, Jae-Hyoung
Ewha Authors
지창현
SCOPUS Author ID
지창현scopus
Issue Date
2019
Journal Title
SENSORS AND ACTUATORS A-PHYSICAL
ISSN
0924-4247JCR Link
Citation
SENSORS AND ACTUATORS A-PHYSICAL vol. 290, pp. 147 - 155
Keywords
Electromagnetic biaxial scanning micromirrorVacuum packagingWafer-level packaging
Publisher
ELSEVIER SCIENCE SA
Indexed
SCI; SCIE; SCOPUS WOS scopus
Document Type
Article
Abstract
We herein present the design, fabrication, and wafer-level packaging of an electromagnetic biaxial scanning micromirror. The vacuum packaging of the micromirror was implemented by anodically bonding the glass cap wafer to both sides of the silicon substrate with the micromirror. The measured quality factor of the vacuum packaged micromirror is 1923.2 for the horizontal scan, whereas that of the device in the air is 649.6. The maximum optical scan angle of the vacuum packaged micromirror is 24.19 degrees at 155 mApp and 11.9 kHz for the horizontal scan, and 7.1 degrees at 204.7 mApp and 60 Hz for the vertical scan. The estimated vacuum level of the package is 1.65 +/- 0.85 Torr. (C) 2019 Elsevier B.V. All rights reserved.
DOI
10.1016/j.sna.2019.03.021
Appears in Collections:
엘텍공과대학 > 전자공학과 > Journal papers
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