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Piezoelectric vibration energy harvester using indirect impact

Title
Piezoelectric vibration energy harvester using indirect impact
Authors
Ju S.Ji C.-H.
Ewha Authors
지창현
SCOPUS Author ID
지창현scopus
Issue Date
2017
Journal Title
Transactions of the Korean Institute of Electrical Engineers
ISSN
1975-8359JCR Link
Citation
Transactions of the Korean Institute of Electrical Engineers vol. 66, no. 10, pp. 1499 - 1507
Keywords
Energy harvestingIndirect impactMFC (Macro fiber composite)
Publisher
Korean Institute of Electrical Engineers
Indexed
SCOPUS; KCI scopus
Document Type
Article
Abstract
This paper presents an impact-based piezoelectric vibration energy harvester using a freely movable metal sphere and a piezoceramic fiber-based MFC (Macro Fiber Composite) as piezoelectric cantilever. The free motion of the metal sphere, which impacts both ends of the cavity in an aluminum housing, generates power across a cantilever-type MFC beam in response to low frequency vibration such as human-body-induced motion. Impacting force of the spherical proof mass is transformed into the vibration of the piezoelectric cantilever indirectly via the aluminum housing. A proof-of-concept energy harvesting device has been fabricated and tested. Effect of the indirect impact-based system has been tested and compared with the direct impact-based counterpart. Maximum peak-to-peak open circuit voltage of 39.8V and average power of 598.9μ W have been obtained at 3g acceleration at 18Hz. Long-term reliability of the fabricated device has been verified by cyclic testing. For the improvement of output performance and reliability, various devices have been tested and compared. Using device fabricated with anodized aluminum housing, maximum peak-to-peak open-circuit voltage of 34.4V and average power of 372.8μW have been obtained at 3g excitation at 20Hz. In terms of reliability, housing with 0.5mm-thick steel plate and anodized aluminum gave improved results with reduced power reduction during initial phase of the cyclic testing. Copyright The Korean Institute of Electrical Engineers.
DOI
10.5370/KIEE.2017.66.10.1499
Appears in Collections:
엘텍공과대학 > 전자공학과 > Journal papers
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