Antiadhesion surface treatments of molds for high-resolution unconventional lithography

Abstract

The capability of the PDMS based antiadhesion surface treatment strategy for high resolution unconventional lithography using hard or soft molds as representatives of imprint lithography or soft lithography was investigated. A thin film of PDMs was used as an antiadhesion release layer as PDMS has a fairly low surface energy and allows for the easy release of the mold from the patterned polymer on the substrates. The surface of the Si wafer was coated with a thin film of PDMS and using this PDMS-coated Si wafer as a hard mold line/space patterns were printed on the SU-8-coated PET substrates. Using this photoresist replica mold as a template for a soft mold the same PDMS-based coating strategy was applied. The imprinting of nanostructure-patterned mold onto a polymer composed of the same chemical as the mold led to pattern collapse during the release of the assembly because of the extremely strong adhesion between the mold and the polymer.