Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 김성진 | * |
dc.date.accessioned | 2016-08-28T10:08:08Z | - |
dc.date.available | 2016-08-28T10:08:08Z | - |
dc.date.issued | 2013 | * |
dc.identifier.issn | 0003-6951 | * |
dc.identifier.other | OAK-10210 | * |
dc.identifier.uri | https://dspace.ewha.ac.kr/handle/2015.oak/223822 | - |
dc.description.abstract | We investigated the thermoelectric properties of the InSe, InSe/In 4Se3 composite, and SrTiO3 (STO) nano-particles dispersed InSe/In4Se3 bulk composites. The electrical conductivity of the InSe/In4Se3 composite with self-assembled phase separation is significantly increased compared with those of InSe and In4Se3-δ implying the enhancement of surface conductivity between grain boundaries. The thermal conductivity of InSe/In4Se3 composite is decreased compared to those of InSe. When the STO nano-particle dispersion was employed in the InSe/In 4Se3 composite, a coherent interface was observed between nano-particle precipitates and the InSe bulk matrix with a reduction of the thermal conductivity. © 2013 AIP Publishing LLC. | * |
dc.language | English | * |
dc.title | Thermoelectric properties of SrTiO3 nano-particles dispersed indium selenide bulk composites | * |
dc.type | Article | * |
dc.relation.issue | 22 | * |
dc.relation.volume | 102 | * |
dc.relation.index | SCI | * |
dc.relation.index | SCIE | * |
dc.relation.index | SCOPUS | * |
dc.relation.journaltitle | Applied Physics Letters | * |
dc.identifier.doi | 10.1063/1.4809677 | * |
dc.identifier.wosid | WOS:000320621600095 | * |
dc.identifier.scopusid | 2-s2.0-84879110535 | * |
dc.author.google | Lee M.H. | * |
dc.author.google | Rhyee J.-S. | * |
dc.author.google | Vaseem M. | * |
dc.author.google | Hahn Y.-B. | * |
dc.author.google | Park S.-D. | * |
dc.author.google | Jin Kim H. | * |
dc.author.google | Kim S.-J. | * |
dc.author.google | Lee H.J. | * |
dc.author.google | Kim C. | * |
dc.contributor.scopusid | 김성진(56812714700) | * |
dc.date.modifydate | 20240301081003 | * |