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Interconnection parameter extraction of printed circuit board by hybrid measurements of TDR and S-parameter

Title
Interconnection parameter extraction of printed circuit board by hybrid measurements of TDR and S-parameter
Authors
Kim, YJWee, JKKim, YHLee, S
Ewha Authors
이성수
Issue Date
2002
Journal Title
ELECTRONICS LETTERS
ISSN
0013-5194JCR Link
Citation
vol. 38, no. 17, pp. 969 - 970
Publisher
IEE-INST ELEC ENG
Indexed
SCI; SCIE; SCOPUS WOS
Abstract
A modified technique for extracting the electrical parameters of transmission line on PCBs is proposed. It exploits hybrid measurements of the time domain and frequency domain response and does not require complicated and erroneous procedures such as DC capacitance measurement and parameter de-embedding. Experimental results show that the proposed method is more accurate than conventional methods.
DOI
10.1049/el:20020683
Appears in Collections:
엘텍공과대학 > 컴퓨터공학과 > Journal papers
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